> Um......as I said, I'm cutting the ic out first then removing the pins seperately. So I guess there is no need for the pads to
come loose, except for the adhesive that holds the copper on getting weak and/or a lame through plate.
Um, presumably you are applying heat to the pins to remove them from the board, regardless of whether
you remove the entire ic or not. Excess heat will weaken the adhesive.
-Mark
>
> I avoid actually desoldering the entire ic whenever possible. Unless you have rework station that's usually asking for trouble.
>
>
>
>
> dunno, but I'm being
> > > EXTREMELY gentle with them (cutting the ic out and removing the pins one at a time) and still have one come loose once
> > > in a while.
>
>
> > Use less heat and make sure to remove as much solder as possible before pulling the device.
> > I generally break the pins loose with a pair of long nose before pulling the actual package.
> >
> > Generally speaking, there is no need to (accidently) pull the plating or pad off one of those holes,
> > unless you're in a rush (which is when it nabs me).
> >
> > -Mark
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Received on Sat Aug 17 18:32:30 2002
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